3D Chip Stacking: Vertical Integration for Performance (Post-2025)
3D Chip Stacking: Vertical Integration for Performance (Post-2025) As we look beyond 2025, the semiconductor industry is increasingly turning to 3D chip stacking as a key strategy for enhancing performance and density. This approach, also known as vertical integration, involves stacking multiple active layers of silicon to create a single, high-performance chip. This article explores the technology, benefits, challenges, and future prospects of 3D chip stacking. What is 3D Chip Stacking? 3D chip stacking is a manufacturing process that involves vertically stacking and interconnecting multiple semiconductor dies. Unlike traditional 2D chip designs, which are limited by the surface area of
